拆封装设备

拆封装设备(Decapsulation Tool)  MA3000D - 151BB(R3T STPRE2005)等离子封装拆除设备特别设计用于快速打开复合封装和聚酰亚胺封装的芯片,但对芯片内部的布线没有任何影响。

MUEGGE’s MA3000D-151BB (R3T STP RE 2005) plasma decapsulation tool has been especially developed for the fast etching of mould compound and polyimide to open microchips without attacking the sensitive wiring.

Key Elements:

  • Optimized for decapsulation of microchips
  • Short decapsulation time at gentle process conditions
  • Very high etch rate and low cost of ownership
  • High environmental compliance due to very high dissociation of warming gases like CF4
  • Removal rate approx. 200 µm per hour (incl. removal of anorganic filling materials)

Key Benefits:

  • No attack on wiring (e.g. Cu and Pd - Cu materials)
  • Slight attack of chip passivation          (selectivity > 500:1)
  • Fast, isotropic etching by radicals only
  • No ions, no radiation, no el. fields at sample

Technical Data:

Dimensions:

L x W x H (mm): approx. 930 x 980 x 2200

Vacuum chuck:

for wafer sizes from 100 mm up to 300 mm

Microwave power:

up to 3000 Watt cont. at 2.45 GHz

Working pressure:

40 Pa – 240 Pa resp. 0.3 Torr – 1.8 Torr

Etch chemistry:

CF4, O2, N2

Removal rate:

approx. 200 µm per hour (incl. removal of anorganic filling materials)

Decapsulation time:

1 - 3 hours after laser ablation

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