MUEGGE’s MA3000D-151BB (R3T STP RE 2005) plasma decapsulation tool has been especially developed for the fast etching of mould compound and polyimide to open microchips without attacking the sensitive wiring.
Dimensions:
L x W x H (mm): approx. 930 x 980 x 2200
Vacuum chuck:
for wafer sizes from 100 mm up to 300 mm
Microwave power:
up to 3000 Watt cont. at 2.45 GHz
Working pressure:
40 Pa – 240 Pa resp. 0.3 Torr – 1.8 Torr
Etch chemistry:
CF4, O2, N2
Removal rate:
approx. 200 µm per hour (incl. removal of anorganic filling materials)
Decapsulation time:
1 - 3 hours after laser ablation
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